[PDF.38zl] Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing)

Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing)

[PDF.vi14] Arbitrary Modeling of TSVs for 3D Integrated Circuits (Analog Circuits and Signal Processing)

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 |  2014-08-22 | Original language:English | PDF # 1 |  9.21 x.31 x6.14l,.0 | File type: PDF | 179 pages

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||From the Back Cover||This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitanc

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon ...

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